CMP Equipment Market : Size, Trends, and Growth Analysis 2032

The CMP Equipment Market is a critical backbone of semiconductor manufacturing, ensuring the structural integrity and electrical performance of modern chips. With a market size valued at US$ 5,860.32 million in 2024, and projected to grow at a CAGR of 5.90% from 2025 to 2032, CMP (Chemical Mechanical Planarization) equipment is gaining renewed attention amid increasing wafer complexity, miniaturization, and high-volume production demands.
As chipmakers push the boundaries of Moore's Law, CMP technology enables precise planarization—flattening wafer surfaces at a nanometer scale to ensure the performance, reliability, and manufacturability of today’s densely packed semiconductor devices.
What is CMP Equipment?
Chemical Mechanical Planarization (CMP) is a semiconductor process that combines both chemical etching and mechanical polishing to remove excess material and smooth wafer surfaces. CMP equipment uses a rotating polishing pad, abrasive slurry, and pressure control systems to evenly planarize layers of metal (like copper or tungsten), dielectric materials, or oxide films on semiconductor wafers.